File:Pad Cratering 03.jpg

Page contents not supported in other languages.
This is a file from the Wikimedia Commons
From Wikipedia, the free encyclopedia

Pad_Cratering_03.jpg ‎(381 × 281 pixels, file size: 20 KB, MIME type: image/jpeg)

Summary

Description
English: Crater left on printed circuit board after copper pad from BGA connection has been pulled away.
Date
Source Integral Technology, Lake Forest, CA
Author Chris Hunrath

Licensing

© The copyright holder of this file allows anyone to use it for any purpose, provided that the copyright holder is properly attributed. Redistribution, derivative work, commercial use, and all other use is permitted.

The categories of this image need checking. You can do so here.
  • Please remove redundant categories and try to put this image in the most specific category/categories.
  • You can remove this template by clicking here (or on the first line).

Captions

Add a one-line explanation of what this file represents

Items portrayed in this file

depicts

inception

1 August 2010

File history

Click on a date/time to view the file as it appeared at that time.

Date/TimeThumbnailDimensionsUserComment
current00:39, 9 November 2010Thumbnail for version as of 00:39, 9 November 2010381 × 281 (20 KB)Rockyh2{{Information |Description={{en|1=Crater left on printed circuit board after copper pad from BGA connection has been pulled away.}} |Source=Integral Technology, Lake Forest, CA |Author=Chris Hunrath |Date=2010-08-01 |Permission= |other_versions= }}
The following pages on the English Wikipedia use this file (pages on other projects are not listed):

Metadata

This file contains additional information, probably added from the digital camera or scanner used to create or digitize it.

If the file has been modified from its original state, some details may not fully reflect the modified file.

Retrieved from "https://en.wikipedia.org/wiki/File:Pad_Cratering_03.jpg"