File:Wirebonding2.svg

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Description
English: A sketch diagram of the wedge-bond wirebonding in a power transistor in a package such as a D2PAK. The copper tab forms the drain connection, as is exposed in the finished product. This whole assembly is held in a rigid, insulating material. The aluminium wires are generally around 250 to 400 µm thick.
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Author Inductiveload
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attribution share alike
This file is licensed under the Creative Commons Attribution-Share Alike 2.5 Generic, 2.0 Generic and 1.0 Generic license.
You are free:
  • to share – to copy, distribute and transmit the work
  • to remix – to adapt the work
Under the following conditions:
  • attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
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Derivative works of this file:  Wirebonding2 DE.svg

Based on Wirebonding.svg by Cyril Buttay.

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19 November 2008

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Date/TimeThumbnailDimensionsUserComment
current07:08, 19 November 2008Thumbnail for version as of 07:08, 19 November 2008600 × 300 (21 KB)InductiveloadSomething odd is going on here. Sorry for any duplicate uploads.
07:07, 19 November 2008Thumbnail for version as of 07:07, 19 November 2008600 × 300 (23 KB)InductiveloadFix minor rendering error
07:07, 19 November 2008Thumbnail for version as of 07:07, 19 November 2008600 × 300 (23 KB)InductiveloadFix minor rendering error
07:04, 19 November 2008Thumbnail for version as of 07:04, 19 November 2008600 × 300 (21 KB)Inductiveload{{Information |Description= |Source= |Date= |Author= |Permission= |other_versions= }}
06:54, 19 November 2008Thumbnail for version as of 06:54, 19 November 2008600 × 300 (23 KB)Inductiveload{{Information |Description={{en|1=A sketch diagram of the wirebonding in a power transistor in a package such as a D2PAK. The copper tab forms the drain connection, as is exposed in the finished product. This whole assembly is held in a rigid, insulating
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