File:Cudeposition.gif
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Summary
| Description |
Molecular dynamics computer simulation of the deposition of a single copper atom with a kinetic energy of 1 eV on a copper surface. Technical details: cross section of two atom layers in the middle of a larger (10x10x10 unit cells) 3D simulation cell. Simulation made with Sabochick-Lam embedded-atom method potential, Berendsen temperature control used only at the outer boundaries to scale temperature down to 0 K. Initial temperature 0 K (cell prerelaxed to allow for surface relaxation inwards). This kind of processes occur in reality during physical vapour deposition. |
| Date | |
| Source | Own work |
| Author | Knordlun |
Licensing
|
This work has been released into the public domain by its author, I, Knordlun. This applies worldwide. In some countries this may not be legally possible; if so: I, Knordlun grants anyone the right to use this work for any purpose, without any conditions, unless such conditions are required by law. |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 12:39, 30 July 2007 | | 320 × 380 (669 KB) | Knordlun | {{Information |Description=Molecular dynamics computer simulation of the deposition of a single copper atom on a copper surface. Technical details: cross section of two atom layers in the middle of a larger 3D simulation cell. Simulation made with Sabochi |
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